Devis PCB
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Devis PCBUpload a Gerber archive (.zip, .rar) or a .kicad_pcb file. Max 50MB.
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Type de PCB 
Rigid, flex, or rigid-flex. This is stored on the order. The material list is for rigid boards; describe a flex stack-up in the special requirement.
Rigid, flex, or rigid-flex. This is stored on the order. The material list is for rigid boards; describe a flex stack-up in the special requirement.Matériau de base Material model can be remarked below. HDI is available for 4-layer or more.
FR-4: fiberglass and epoxy, for double-sided and multilayer boards.
Aluminum: heat dissipation for LEDs and power.
22F: paper epoxy, single-sided.
FR-1: paper phenolic, single-sided, not for reflow.
Special: describe the material in the note.
Material model can be remarked below. HDI is available for 4-layer or more.
FR-4: fiberglass and epoxy, for double-sided and multilayer boards.
Aluminum: heat dissipation for LEDs and power.
22F: paper epoxy, single-sided.
FR-1: paper phenolic, single-sided, not for reflow.
Special: describe the material in the note.Nombre de couches Single-layer and double-layer prices are often close. Cost rises as layers increase.
Single-layer production does not keep copper in the holes. If the holes must be plated, order a double-layer board.
On a single-layer board, check that traces and silkscreen are not mirrored.
Single-layer and double-layer prices are often close. Cost rises as layers increase.
Single-layer production does not keep copper in the holes. If the holes must be plated, order a double-layer board.
On a single-layer board, check that traces and silkscreen are not mirrored.Valeur TG Glass transition temperature. A higher TG withstands more heat. TG180 is not offered.
Glass transition temperature. A higher TG withstands more heat. TG180 is not offered.Type de carte Single piece: one board in the file. A panelized file is still built as a single board.
Panel by Customer: you supply the panel, including breakaway tabs.
Panel by PCBasic: you supply one board and the factory panels it. Fiducials are added by default. Best for a regular outline.
Single piece: one board in the file. A panelized file is still built as a single board.
Panel by Customer: you supply the panel, including breakaway tabs.
Panel by PCBasic: you supply one board and the factory panels it. Fiducials are added by default. Best for a regular outline.Dimensions (pièce) *Length × width of the delivered board, in mm.
A round board uses the diameter. An irregular board uses the maximum width and height.
Length × width of the delivered board, in mm.
A round board uses the diameter. An irregular board uses the maximum width and height.×mm
Quantité (unitaire) *How many boards you receive.
Single piece: count boards (pcs).
Panel: count panels (set), not the pieces inside each panel.
How many boards you receive.
Single piece: count boards (pcs).
Panel: count panels (set), not the pieces inside each panel.pcs
Designs différents How many different PCB designs are in this one order. There is no upper limit of 5.
How many different PCB designs are in this one order. There is no upper limit of 5.Épaisseur PCB (mm) Finished board thickness. At least 1.0 mm: about ±10%. Below 1.0 mm: about ±0.1 mm.
0.8–1.6 mm is the usual range.
Finished board thickness. At least 1.0 mm: about ±10%. Below 1.0 mm: about ±0.1 mm.
0.8–1.6 mm is the usual range.Cuivre externe Outer copper foil. The choices change with board thickness. 1 oz is the usual default. Thickness starts at 1 oz.
Outer copper foil. The choices change with board thickness. 1 oz is the usual default. Thickness starts at 1 oz.Couleur du vernis épargne Green is the standard color.
Matte black makes faults harder to see.
A single-sided board is masked on the circuit side.
Ink shade can differ slightly between batches.
White and black masks hide the same silkscreen color.
Green is the standard color.
Matte black makes faults harder to see.
A single-sided board is masked on the circuit side.
Ink shade can differ slightly between batches.
White and black masks hide the same silkscreen color.Sérigraphie White, black, or none. The legend is hidden when it is the same color as the solder mask.
White, black, or none. The legend is hidden when it is the same color as the solder mask.Largeur/espacement mini des pistes Narrowest trace and the gap between two traces. 6/6 and above marked with ↑ means that width or looser.
Narrowest trace and the gap between two traces. 6/6 and above marked with ↑ means that width or looser.Perçage minimal Smallest mechanical drill. A smaller hole costs more to drill. Choices run from 0.12 mm to 0.8 mm.
Smallest mechanical drill. A smaller hole costs more to drill. Choices run from 0.12 mm to 0.8 mm.Traitement des vias A Gerber is followed as drawn, because it cannot tell a via from a component hole.
Covering: mask over the via. Yellowing or a trapped solder ball can be normal.
Opening: the via and pad stay free of mask and take the surface finish.
Mask fill and aluminum-assisted fill: vias should be 0.5 mm or smaller.
Resin fill with a copper cap is for a flat via-in-pad, also 0.5 mm or smaller.
A Gerber is followed as drawn, because it cannot tell a via from a component hole.
Covering: mask over the via. Yellowing or a trapped solder ball can be normal.
Opening: the via and pad stay free of mask and take the surface finish.
Mask fill and aluminum-assisted fill: vias should be 0.5 mm or smaller.
Resin fill with a copper cap is for a flat via-in-pad, also 0.5 mm or smaller.Les vias au-dessus de la limite sont recouverts. Le Gerber prime.
Méthode de test FR-4 and Special: flying probe, or a fixture.
Aluminum, 22F, and FR-1: AOI, or a fixture.
FR-4 and Special: flying probe, or a fixture.
Aluminum, 22F, and FR-1: AOI, or a fixture.Finition de surface Leaded HASL: low cost, uneven, not for fine pitch or BGA.
Lead-free HASL is the default. It is also a poor fit for BGA.
ENIG: flat, for fine pitch. Then choose gold thickness.
OSP: flat and low cost. Solder soon after the package is opened.
Leaded HASL: low cost, uneven, not for fine pitch or BGA.
Lead-free HASL is the default. It is also a poor fit for BGA.
ENIG: flat, for fine pitch. Then choose gold thickness.
OSP: flat and low cost. Solder soon after the package is opened.Contrôle d’impédance Choose Yes only when impedance or a specific stack-up is required, and upload the trace locations and target values.
No uses the standard stack-up.
Choose Yes only when impedance or a specific stack-up is required, and upload the trace locations and target values.
No uses the standard stack-up.Méthode de détourage Mold forming is the outline method on this form.
Mold forming is the outline method on this form.Trous métallisés en bord Plated half-holes on the board edge, for soldering a module.
Hole at least 0.6 mm. Pad to edge at least 1 mm. Board at least 10 × 10 mm.
Plated half-holes on the board edge, for soldering a module.
Hole at least 0.6 mm. Pad to edge at least 1 mm. Board at least 10 × 10 mm.Épaisseur de cuivre PTH Default hole-wall copper is 18 μm.
30 μm and 35 μm need outer copper of at least 1.5 oz, so they appear only then.
Default hole-wall copper is 18 μm.
30 μm and 35 μm need outer copper of at least 1.5 oz, so they appear only then.Préparation avant dépôt
Technique spéciale Optional extras: metallized edge, carbon ink, serial number, blue glue, countersink, crimp hole, CTI ≥ 600. Select any that the board needs.
Optional extras: metallized edge, carbon ink, serial number, blue glue, countersink, crimp hole, CTI ≥ 600. Select any that the board needs.Compensation qualité Standard follows the product contract.
Full component compensation is a paid premium service for production defects such as opens and shorts, not for design mistakes. Raise a concern within 6 months of delivery. Pair it with four-wire via testing.
Standard follows the product contract.
Full component compensation is a paid premium service for production defects such as opens and shorts, not for design mistakes. Raise a concern within 6 months of delivery. Pair it with four-wire via testing.Test quatre fils des vias Finds weak vias that a normal test can miss. Use it for high-reliability boards. Consumer boards usually stay on None.
Finds weak vias that a normal test can miss. Use it for high-reliability boards. Consumer boards usually stay on None.Confirmation du dossier de fabrication Yes: after payment you review the production files, and the lead time starts when you confirm.
No: production starts from your files.
$5 within 1 m², free above that.
Yes: after payment you review the production files, and the lead time starts when you confirm.
No: production starts from your files.
$5 within 1 m², free above that.Reconfirmation : 5 $ jusqu’à 1 m², gratuit au-delà.
Rapport de test Reports can add a little time before shipment.
Electrical: opens and shorts. Final inspection: look and size. Microsection: copper and dielectric. The others cover plating thickness, solderability, ionic residue, and thermal shock.
Reports can add a little time before shipment.
Electrical: opens and shorts. Final inspection: look and size. Microsection: copper and dielectric. The others cover plating thickness, solderability, ionic residue, and thermal shock.Type de rapport Electronic reports are downloaded from My Orders. Paper is a printed copy.
Electronic reports are downloaded from My Orders. Paper is a printed copy.Download electronic reports from My Orders.
Tolérance de contour ±0.2 mm is one-pass routing.
±0.1 mm needs positioning holes of about 1.5 mm on different corners, and each side over 5 cm when the board ships as a single piece.
±0.2 mm is one-pass routing.
±0.1 mm needs positioning holes of about 1.5 mm on different corners, and each side over 5 cm when the board ships as a single piece.Niveau IPC IPC-II is the default. IPC-III is tighter.
Scratches show more on blue, black, and other non-green masks.
IPC-II is the default. IPC-III is tighter.
Scratches show more on blue, black, and other non-green masks.Papier intercalaire A sheet between boards to reduce scratches. Not offered when either side is under 50 mm.
A sheet between boards to reduce scratches. Not offered when either side is under 50 mm.En cas de conflit de données *If the form and the file notes disagree, follow the form, follow the files, or ask us to confirm. Choose one before placing the order.
If the form and the file notes disagree, follow the form, follow the files, or ask us to confirm. Choose one before placing the order.PO No.
Ref. order No.
Exigence particulière Optional. If you write one, use 5–1000 characters. Mention plugging, stack-up, or other process notes here.
Optional. If you write one, use 5–1000 characters. Mention plugging, stack-up, or other process notes here.