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PCB QuoteUpload Gerber / PCB files: .zip, .rar, .7z, .pcb, .kicad_pcb. Max 50MB.
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PCB type 
Rigid, flex, or rigid-flex. This is stored on the order. The material list is for rigid boards; describe a flex stack-up in the special requirement.
Rigid, flex, or rigid-flex. This is stored on the order. The material list is for rigid boards; describe a flex stack-up in the special requirement.Base Material Material model can be remarked below. HDI is available for 4-layer or more.
FR-4: fiberglass and epoxy, for double-sided and multilayer boards.
Aluminum: heat dissipation for LEDs and power.
22F: paper epoxy, single-sided.
FR-1: paper phenolic, single-sided, not for reflow.
Special: describe the material in the note.
Material model can be remarked below. HDI is available for 4-layer or more.
FR-4: fiberglass and epoxy, for double-sided and multilayer boards.
Aluminum: heat dissipation for LEDs and power.
22F: paper epoxy, single-sided.
FR-1: paper phenolic, single-sided, not for reflow.
Special: describe the material in the note.Layer count Single-layer and double-layer prices are often close. Cost rises as layers increase.
Single-layer production does not keep copper in the holes. If the holes must be plated, order a double-layer board.
On a single-layer board, check that traces and silkscreen are not mirrored.
Single-layer and double-layer prices are often close. Cost rises as layers increase.
Single-layer production does not keep copper in the holes. If the holes must be plated, order a double-layer board.
On a single-layer board, check that traces and silkscreen are not mirrored.TG Rating Glass transition temperature. A higher TG withstands more heat. TG180 is not offered.
Glass transition temperature. A higher TG withstands more heat. TG180 is not offered.Board type Single piece: one board in the file. A panelized file is still built as a single board.
Panel by Customer: you supply the panel, including breakaway tabs.
Panel by PCBasic: you supply one board and the factory panels it. Fiducials are added by default. Best for a regular outline.
Single piece: one board in the file. A panelized file is still built as a single board.
Panel by Customer: you supply the panel, including breakaway tabs.
Panel by PCBasic: you supply one board and the factory panels it. Fiducials are added by default. Best for a regular outline.Size (single) *Length × width of the delivered board, in mm.
A round board uses the diameter. An irregular board uses the maximum width and height.
Length × width of the delivered board, in mm.
A round board uses the diameter. An irregular board uses the maximum width and height.×mm
Quantity (single) *How many boards you receive.
Single piece: count boards (pcs).
Panel: count panels (set), not the pieces inside each panel.
How many boards you receive.
Single piece: count boards (pcs).
Panel: count panels (set), not the pieces inside each panel.pcs
Different designs How many different PCB designs are in this one order. There is no upper limit of 5.
How many different PCB designs are in this one order. There is no upper limit of 5.PCB thickness(mm) Finished board thickness. At least 1.0 mm: about ±10%. Below 1.0 mm: about ±0.1 mm.
0.8–1.6 mm is the usual range.
Finished board thickness. At least 1.0 mm: about ±10%. Below 1.0 mm: about ±0.1 mm.
0.8–1.6 mm is the usual range.Outer Copper Weight Outer copper foil. The choices change with board thickness. 1 oz is the usual default. Thickness starts at 1 oz.
Outer copper foil. The choices change with board thickness. 1 oz is the usual default. Thickness starts at 1 oz.Soldermask color Green is the standard color.
Matte black makes faults harder to see.
A single-sided board is masked on the circuit side.
Ink shade can differ slightly between batches.
White and black masks hide the same silkscreen color.
Green is the standard color.
Matte black makes faults harder to see.
A single-sided board is masked on the circuit side.
Ink shade can differ slightly between batches.
White and black masks hide the same silkscreen color.Silkscreen White, black, or none. The legend is hidden when it is the same color as the solder mask.
White, black, or none. The legend is hidden when it is the same color as the solder mask.Minimum trace width/spacing Narrowest trace and the gap between two traces. 6/6 and above marked with ↑ means that width or looser.
Narrowest trace and the gap between two traces. 6/6 and above marked with ↑ means that width or looser.Min. drill hole Smallest via. Huaqiu accepts 0.2 mm, 0.25 mm, or 0.3 mm and above.
Smallest via. Huaqiu accepts 0.2 mm, 0.25 mm, or 0.3 mm and above.Via Processing A Gerber is followed as drawn, because it cannot tell a via from a component hole.
Covering: mask over the via. Yellowing or a trapped solder ball can be normal.
Opening: the via and pad stay free of mask and take the surface finish.
Mask fill and aluminum-assisted fill: vias should be 0.5 mm or smaller.
Resin fill with a copper cap is for a flat via-in-pad, also 0.5 mm or smaller.
A Gerber is followed as drawn, because it cannot tell a via from a component hole.
Covering: mask over the via. Yellowing or a trapped solder ball can be normal.
Opening: the via and pad stay free of mask and take the surface finish.
Mask fill and aluminum-assisted fill: vias should be 0.5 mm or smaller.
Resin fill with a copper cap is for a flat via-in-pad, also 0.5 mm or smaller.Vias over the plugging limit are tented. Gerber files take precedence, and this option is ignored when the file already shows the via.
Test method FR-4 and Special: flying probe, or a fixture.
Aluminum, 22F, and FR-1: AOI, or a fixture.
FR-4 and Special: flying probe, or a fixture.
Aluminum, 22F, and FR-1: AOI, or a fixture.Surface Finish Leaded HASL: low cost, uneven, not for fine pitch or BGA.
Lead-free HASL is the default. It is also a poor fit for BGA.
ENIG: flat, for fine pitch. Then choose gold thickness.
OSP: flat and low cost. Solder soon after the package is opened.
Leaded HASL: low cost, uneven, not for fine pitch or BGA.
Lead-free HASL is the default. It is also a poor fit for BGA.
ENIG: flat, for fine pitch. Then choose gold thickness.
OSP: flat and low cost. Solder soon after the package is opened.Impedance control Choose Yes only when impedance or a specific stack-up is required, and upload the trace locations and target values.
No uses the standard stack-up.
Choose Yes only when impedance or a specific stack-up is required, and upload the trace locations and target values.
No uses the standard stack-up.Profiling method Mold forming is the outline method on this form.
Mold forming is the outline method on this form.Castellated holes Plated half-holes on the board edge, for soldering a module.
Hole at least 0.6 mm. Pad to edge at least 1 mm. Board at least 10 × 10 mm.
Plated half-holes on the board edge, for soldering a module.
Hole at least 0.6 mm. Pad to edge at least 1 mm. Board at least 10 × 10 mm.PTH copper thickness Default hole-wall copper is 18 μm.
30 μm and 35 μm need outer copper of at least 1.5 oz, so they appear only then.
Default hole-wall copper is 18 μm.
30 μm and 35 μm need outer copper of at least 1.5 oz, so they appear only then.Pre-plating process
Special technique Optional extras: metallized edge, carbon ink, serial number, blue glue, countersink, crimp hole, CTI ≥ 600. Select any that the board needs.
Optional extras: metallized edge, carbon ink, serial number, blue glue, countersink, crimp hole, CTI ≥ 600. Select any that the board needs.Quality compensation Standard follows the product contract.
Full component compensation is a paid premium service for production defects such as opens and shorts, not for design mistakes. Raise a concern within 6 months of delivery. Pair it with four-wire via testing.
Standard follows the product contract.
Full component compensation is a paid premium service for production defects such as opens and shorts, not for design mistakes. Raise a concern within 6 months of delivery. Pair it with four-wire via testing.Four-wire resistance test for vias Finds weak vias that a normal test can miss. Use it for high-reliability boards. Consumer boards usually stay on None.
Finds weak vias that a normal test can miss. Use it for high-reliability boards. Consumer boards usually stay on None.Production file confirmation Yes: after payment you review the production files, and the lead time starts when you confirm.
No: production starts from your files.
$5 within 1 m², free above that.
Yes: after payment you review the production files, and the lead time starts when you confirm.
No: production starts from your files.
$5 within 1 m², free above that.Re-confirmation before release: $5 when the order is within 1 m², free above that.
Test report Reports can add a little time before shipment.
Electrical: opens and shorts. Final inspection: look and size. Microsection: copper and dielectric. The others cover plating thickness, solderability, ionic residue, and thermal shock.
Reports can add a little time before shipment.
Electrical: opens and shorts. Final inspection: look and size. Microsection: copper and dielectric. The others cover plating thickness, solderability, ionic residue, and thermal shock.Test report type Electronic reports are downloaded from My Orders. Paper is a printed copy.
Electronic reports are downloaded from My Orders. Paper is a printed copy.Download electronic reports from My Orders.
Routing outline tolerance ±0.2 mm is one-pass routing.
±0.1 mm needs positioning holes of about 1.5 mm on different corners, and each side over 5 cm when the board ships as a single piece.
±0.2 mm is one-pass routing.
±0.1 mm needs positioning holes of about 1.5 mm on different corners, and each side over 5 cm when the board ships as a single piece.IPC level IPC-II is the default. IPC-III is tighter.
Scratches show more on blue, black, and other non-green masks.
IPC-II is the default. IPC-III is tighter.
Scratches show more on blue, black, and other non-green masks.Interleaving paper A sheet between boards to reduce scratches. Not offered when either side is under 50 mm.
A sheet between boards to reduce scratches. Not offered when either side is under 50 mm.If data conflicts *If the form and the file notes disagree, follow the form, follow the files, or ask us to confirm. Choose one before placing the order.
If the form and the file notes disagree, follow the form, follow the files, or ask us to confirm. Choose one before placing the order.PO No.
Ref. order No.
Special requirement Optional. If you write one, use 5–1000 characters. Mention plugging, stack-up, or other process notes here.
Optional. If you write one, use 5–1000 characters. Mention plugging, stack-up, or other process notes here.