PCB見積
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PCB見積Upload a Gerber archive (.zip, .rar) or a .kicad_pcb file. Max 50MB.
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Rigid, flex, or rigid-flex. This is stored on the order. The material list is for rigid boards; describe a flex stack-up in the special requirement.
Rigid, flex, or rigid-flex. This is stored on the order. The material list is for rigid boards; describe a flex stack-up in the special requirement.基材 Material model can be remarked below. HDI is available for 4-layer or more.
FR-4: fiberglass and epoxy, for double-sided and multilayer boards.
Aluminum: heat dissipation for LEDs and power.
22F: paper epoxy, single-sided.
FR-1: paper phenolic, single-sided, not for reflow.
Special: describe the material in the note.
Material model can be remarked below. HDI is available for 4-layer or more.
FR-4: fiberglass and epoxy, for double-sided and multilayer boards.
Aluminum: heat dissipation for LEDs and power.
22F: paper epoxy, single-sided.
FR-1: paper phenolic, single-sided, not for reflow.
Special: describe the material in the note.層数 Single-layer and double-layer prices are often close. Cost rises as layers increase.
Single-layer production does not keep copper in the holes. If the holes must be plated, order a double-layer board.
On a single-layer board, check that traces and silkscreen are not mirrored.
Single-layer and double-layer prices are often close. Cost rises as layers increase.
Single-layer production does not keep copper in the holes. If the holes must be plated, order a double-layer board.
On a single-layer board, check that traces and silkscreen are not mirrored.TG値 Glass transition temperature. A higher TG withstands more heat. TG180 is not offered.
Glass transition temperature. A higher TG withstands more heat. TG180 is not offered.出荷形態 Single piece: one board in the file. A panelized file is still built as a single board.
Panel by Customer: you supply the panel, including breakaway tabs.
Panel by PCBasic: you supply one board and the factory panels it. Fiducials are added by default. Best for a regular outline.
Single piece: one board in the file. A panelized file is still built as a single board.
Panel by Customer: you supply the panel, including breakaway tabs.
Panel by PCBasic: you supply one board and the factory panels it. Fiducials are added by default. Best for a regular outline.サイズ（単品） *Length × width of the delivered board, in mm.
A round board uses the diameter. An irregular board uses the maximum width and height.
Length × width of the delivered board, in mm.
A round board uses the diameter. An irregular board uses the maximum width and height.×mm
数量（単品） *How many boards you receive.
Single piece: count boards (pcs).
Panel: count panels (set), not the pieces inside each panel.
How many boards you receive.
Single piece: count boards (pcs).
Panel: count panels (set), not the pieces inside each panel.枚
デザイン種数 How many different PCB designs are in this one order. There is no upper limit of 5.
How many different PCB designs are in this one order. There is no upper limit of 5.板厚 (mm) Finished board thickness. At least 1.0 mm: about ±10%. Below 1.0 mm: about ±0.1 mm.
0.8–1.6 mm is the usual range.
Finished board thickness. At least 1.0 mm: about ±10%. Below 1.0 mm: about ±0.1 mm.
0.8–1.6 mm is the usual range.外層銅箔厚 Outer copper foil. The choices change with board thickness. 1 oz is the usual default. Thickness starts at 1 oz.
Outer copper foil. The choices change with board thickness. 1 oz is the usual default. Thickness starts at 1 oz.ソルダレジスト色 Green is the standard color.
Matte black makes faults harder to see.
A single-sided board is masked on the circuit side.
Ink shade can differ slightly between batches.
White and black masks hide the same silkscreen color.
Green is the standard color.
Matte black makes faults harder to see.
A single-sided board is masked on the circuit side.
Ink shade can differ slightly between batches.
White and black masks hide the same silkscreen color.シルク色 White, black, or none. The legend is hidden when it is the same color as the solder mask.
White, black, or none. The legend is hidden when it is the same color as the solder mask.最小パターン幅/間隔 Narrowest trace and the gap between two traces. 6/6 and above marked with ↑ means that width or looser.
Narrowest trace and the gap between two traces. 6/6 and above marked with ↑ means that width or looser.最小穴径 Smallest mechanical drill. A smaller hole costs more to drill. Choices run from 0.12 mm to 0.8 mm.
Smallest mechanical drill. A smaller hole costs more to drill. Choices run from 0.12 mm to 0.8 mm.ビア処理 A Gerber is followed as drawn, because it cannot tell a via from a component hole.
Covering: mask over the via. Yellowing or a trapped solder ball can be normal.
Opening: the via and pad stay free of mask and take the surface finish.
Mask fill and aluminum-assisted fill: vias should be 0.5 mm or smaller.
Resin fill with a copper cap is for a flat via-in-pad, also 0.5 mm or smaller.
A Gerber is followed as drawn, because it cannot tell a via from a component hole.
Covering: mask over the via. Yellowing or a trapped solder ball can be normal.
Opening: the via and pad stay free of mask and take the surface finish.
Mask fill and aluminum-assisted fill: vias should be 0.5 mm or smaller.
Resin fill with a copper cap is for a flat via-in-pad, also 0.5 mm or smaller.塞孔限度を超えるビアは蓋をします。Gerber が優先されます。
検査方法 FR-4 and Special: flying probe, or a fixture.
Aluminum, 22F, and FR-1: AOI, or a fixture.
FR-4 and Special: flying probe, or a fixture.
Aluminum, 22F, and FR-1: AOI, or a fixture.表面処理 Leaded HASL: low cost, uneven, not for fine pitch or BGA.
Lead-free HASL is the default. It is also a poor fit for BGA.
ENIG: flat, for fine pitch. Then choose gold thickness.
OSP: flat and low cost. Solder soon after the package is opened.
Leaded HASL: low cost, uneven, not for fine pitch or BGA.
Lead-free HASL is the default. It is also a poor fit for BGA.
ENIG: flat, for fine pitch. Then choose gold thickness.
OSP: flat and low cost. Solder soon after the package is opened.インピーダンス制御 Choose Yes only when impedance or a specific stack-up is required, and upload the trace locations and target values.
No uses the standard stack-up.
Choose Yes only when impedance or a specific stack-up is required, and upload the trace locations and target values.
No uses the standard stack-up.外形加工 Mold forming is the outline method on this form.
Mold forming is the outline method on this form.キャスタレーション Plated half-holes on the board edge, for soldering a module.
Hole at least 0.6 mm. Pad to edge at least 1 mm. Board at least 10 × 10 mm.
Plated half-holes on the board edge, for soldering a module.
Hole at least 0.6 mm. Pad to edge at least 1 mm. Board at least 10 × 10 mm.PTH銅厚 Default hole-wall copper is 18 μm.
30 μm and 35 μm need outer copper of at least 1.5 oz, so they appear only then.
Default hole-wall copper is 18 μm.
30 μm and 35 μm need outer copper of at least 1.5 oz, so they appear only then.めっき前処理
特殊工程 Optional extras: metallized edge, carbon ink, serial number, blue glue, countersink, crimp hole, CTI ≥ 600. Select any that the board needs.
Optional extras: metallized edge, carbon ink, serial number, blue glue, countersink, crimp hole, CTI ≥ 600. Select any that the board needs.品質補償 Standard follows the product contract.
Full component compensation is a paid premium service for production defects such as opens and shorts, not for design mistakes. Raise a concern within 6 months of delivery. Pair it with four-wire via testing.
Standard follows the product contract.
Full component compensation is a paid premium service for production defects such as opens and shorts, not for design mistakes. Raise a concern within 6 months of delivery. Pair it with four-wire via testing.ビア四線式抵抗テスト Finds weak vias that a normal test can miss. Use it for high-reliability boards. Consumer boards usually stay on None.
Finds weak vias that a normal test can miss. Use it for high-reliability boards. Consumer boards usually stay on None.製造データ確認 Yes: after payment you review the production files, and the lead time starts when you confirm.
No: production starts from your files.
$5 within 1 m², free above that.
Yes: after payment you review the production files, and the lead time starts when you confirm.
No: production starts from your files.
$5 within 1 m², free above that.製造前の再確認：1㎡以内は $5、それを超えると無料。
試験レポート Reports can add a little time before shipment.
Electrical: opens and shorts. Final inspection: look and size. Microsection: copper and dielectric. The others cover plating thickness, solderability, ionic residue, and thermal shock.
Reports can add a little time before shipment.
Electrical: opens and shorts. Final inspection: look and size. Microsection: copper and dielectric. The others cover plating thickness, solderability, ionic residue, and thermal shock.レポート形式 Electronic reports are downloaded from My Orders. Paper is a printed copy.
Electronic reports are downloaded from My Orders. Paper is a printed copy.Download electronic reports from My Orders.
外形公差 ±0.2 mm is one-pass routing.
±0.1 mm needs positioning holes of about 1.5 mm on different corners, and each side over 5 cm when the board ships as a single piece.
±0.2 mm is one-pass routing.
±0.1 mm needs positioning holes of about 1.5 mm on different corners, and each side over 5 cm when the board ships as a single piece.IPCレベル IPC-II is the default. IPC-III is tighter.
Scratches show more on blue, black, and other non-green masks.
IPC-II is the default. IPC-III is tighter.
Scratches show more on blue, black, and other non-green masks.合紙 A sheet between boards to reduce scratches. Not offered when either side is under 50 mm.
A sheet between boards to reduce scratches. Not offered when either side is under 50 mm.データが矛盾する場合 *If the form and the file notes disagree, follow the form, follow the files, or ask us to confirm. Choose one before placing the order.
If the form and the file notes disagree, follow the form, follow the files, or ask us to confirm. Choose one before placing the order.PO No.
Ref. order No.
特別要件 Optional. If you write one, use 5–1000 characters. Mention plugging, stack-up, or other process notes here.
Optional. If you write one, use 5–1000 characters. Mention plugging, stack-up, or other process notes here.