Расчёт PCB
Upload a Gerber archive (.zip, .rar) or a .kicad_pcb file. Max 50MB.
Все загрузки защищены и конфиденциальны
Тип платы
Rigid, flex, or rigid-flex. This is stored on the order. The material list is for rigid boards; describe a flex stack-up in the special requirement.
Базовый материал
Material model can be remarked below. HDI is available for 4-layer or more.
FR-4: fiberglass and epoxy, for double-sided and multilayer boards.
Aluminum: heat dissipation for LEDs and power.
22F: paper epoxy, single-sided.
FR-1: paper phenolic, single-sided, not for reflow.
Special: describe the material in the note.
Число слоёв
Single-layer and double-layer prices are often close. Cost rises as layers increase.
Single-layer production does not keep copper in the holes. If the holes must be plated, order a double-layer board.
On a single-layer board, check that traces and silkscreen are not mirrored.
Значение TG
Glass transition temperature. A higher TG withstands more heat. TG180 is not offered.
Тип платы
Single piece: one board in the file. A panelized file is still built as a single board.
Panel by Customer: you supply the panel, including breakaway tabs.
Panel by PCBasic: you supply one board and the factory panels it. Fiducials are added by default. Best for a regular outline.
Размер (штука) *
Length × width of the delivered board, in mm.
A round board uses the diameter. An irregular board uses the maximum width and height.
×mm
Количество (штука) *
How many boards you receive.
Single piece: count boards (pcs).
Panel: count panels (set), not the pieces inside each panel.
шт.
Разные дизайны
How many different PCB designs are in this one order. There is no upper limit of 5.
Толщина PCB (мм)
Finished board thickness. At least 1.0 mm: about ±10%. Below 1.0 mm: about ±0.1 mm.
0.8–1.6 mm is the usual range.
Внешняя медь
Outer copper foil. The choices change with board thickness. 1 oz is the usual default. Thickness starts at 1 oz.
Цвет маски
Green is the standard color.
Matte black makes faults harder to see.
A single-sided board is masked on the circuit side.
Ink shade can differ slightly between batches.
White and black masks hide the same silkscreen color.
Шелкография
White, black, or none. The legend is hidden when it is the same color as the solder mask.
Мин. ширина/зазор дорожки
Narrowest trace and the gap between two traces. 6/6 and above marked with ↑ means that width or looser.
Мин. отверстие
Smallest mechanical drill. A smaller hole costs more to drill. Choices run from 0.12 mm to 0.8 mm.
Обработка переходных отверстий
A Gerber is followed as drawn, because it cannot tell a via from a component hole.
Covering: mask over the via. Yellowing or a trapped solder ball can be normal.
Opening: the via and pad stay free of mask and take the surface finish.
Mask fill and aluminum-assisted fill: vias should be 0.5 mm or smaller.
Resin fill with a copper cap is for a flat via-in-pad, also 0.5 mm or smaller.
Отверстия сверх предела закрываются маской. Gerber имеет приоритет.
Метод теста
FR-4 and Special: flying probe, or a fixture.
Aluminum, 22F, and FR-1: AOI, or a fixture.
Финишное покрытие
Leaded HASL: low cost, uneven, not for fine pitch or BGA.
Lead-free HASL is the default. It is also a poor fit for BGA.
ENIG: flat, for fine pitch. Then choose gold thickness.
OSP: flat and low cost. Solder soon after the package is opened.
Контроль импеданса
Choose Yes only when impedance or a specific stack-up is required, and upload the trace locations and target values.
No uses the standard stack-up.
Способ контура
Mold forming is the outline method on this form.
Краевые отверстия
Plated half-holes on the board edge, for soldering a module.
Hole at least 0.6 mm. Pad to edge at least 1 mm. Board at least 10 × 10 mm.
Толщина меди PTH
Default hole-wall copper is 18 μm.
30 μm and 35 μm need outer copper of at least 1.5 oz, so they appear only then.
Подготовка перед металлизацией
Спецпроцесс
Optional extras: metallized edge, carbon ink, serial number, blue glue, countersink, crimp hole, CTI ≥ 600. Select any that the board needs.
Компенсация качества
Standard follows the product contract.
Full component compensation is a paid premium service for production defects such as opens and shorts, not for design mistakes. Raise a concern within 6 months of delivery. Pair it with four-wire via testing.
Четырёхпроводный тест переходных отверстий
Finds weak vias that a normal test can miss. Use it for high-reliability boards. Consumer boards usually stay on None.
Подтверждение производственных файлов
Yes: after payment you review the production files, and the lead time starts when you confirm.
No: production starts from your files.
$5 within 1 m², free above that.
Повторное подтверждение: $5 до 1 м², выше бесплатно.
Протокол испытаний
Reports can add a little time before shipment.
Electrical: opens and shorts. Final inspection: look and size. Microsection: copper and dielectric. The others cover plating thickness, solderability, ionic residue, and thermal shock.
Вид протокола
Electronic reports are downloaded from My Orders. Paper is a printed copy.
Download electronic reports from My Orders.
Допуск контура
±0.2 mm is one-pass routing.
±0.1 mm needs positioning holes of about 1.5 mm on different corners, and each side over 5 cm when the board ships as a single piece.
Уровень IPC
IPC-II is the default. IPC-III is tighter.
Scratches show more on blue, black, and other non-green masks.
Прокладочная бумага
A sheet between boards to reduce scratches. Not offered when either side is under 50 mm.
Если данные расходятся *
If the form and the file notes disagree, follow the form, follow the files, or ask us to confirm. Choose one before placing the order.
PO No.
Ref. order No.
Особые требования
Optional. If you write one, use 5–1000 characters. Mention plugging, stack-up, or other process notes here.
